INTRODUCTION
RAM is
the acronym of Random Access Memory that computer uses to run its operation and
other application you lunched or opened. Also can be defined as volatile
computer memory that store and provide data to the user temporary, it lost all
data if power cutoff. Computer system has different size, such as desktop,
laptop and tablet. Therefore RAM also has different types, size and terminologies
as follows:
Terminologies in RAM:
-Pins:
Means number of contact contained in RAM, it can also refer as lead.
-Bus: is a portion of
area that transfer large numbers of signals within different integrated
circuits. For instant FSB( Front Side Bus) it transfer data from CPU to the
memory controller and other destinations.
Subgroup of buses:
-Memory
bus which links the memory controller.
-Address
bus contained in RAM.
-Data
bus.
-Command
bus.
Parity:
Is
a section of an error checking process that can be used to verify the integrity
of information stored in RAM? It has “parity bit” that is even parity and odd
parity.
ECC: Error correction
code RAM is the additional data storage for checksum bits to permit correction
of errors. The memory controller on motherboard must be compatible with ECC.
SPD (Serial Presence Detect- Circuit
(an EEPROM) :
EEPROM
is the Acronym of Electrically Erasable Programmable Read only memory that
built inside memory module. It has responsibility of sending information to the
BIOS, then to the memory controller to highlight it what category and how much
memory is present.
Heat Spreader:
This
is heat sink, it disperse heat developed by RAM as a result energy transfer. It
cool the RAM. It also gives room for the manufacturer to design their logs on
it.
Virtual memory:
Is
a RAM that is simulated by the system when the space full in real memory
modules. It is actually space on the hard Drive, this made it slower in terms
of accessing.
Latency:
This refers to delay interval of RAM.
Bank: is a group of
memory chips. That joint together to supply enough data bits to be equal CPU
data bus(32 bit wide).
Rank: This
refers to raw of memory chips. It can be double rank. Which is very common
presently?
Cache memory: It
is term used to identify a number of distinct functions inside computer system.
Its function to improve performance of system.
Features of Cache memory:
-It is the separate
store of SRAM used by CPU to store the most frequently used information.
-It
can be access very fast than RAM itself.
-It
consists of many levels of cache, there closeness to CPU, determine its high
speed of access. For instant Level 1 Cache is normally part of CPU chip itself.
While Level 2 and Level 3 are external usually on motherboard.
Types of RAM:
-SIMM (Single inline memory module) :
It contained obsolete power and data contacts on only one side
of the board. Is the type of memory sticks with 30pins.
-DRAM (Dynamic Random Access Memory): It
required refreshing constantly and it used in PC.
Features:
-it
has low cost of production.
-It
has higher memory capacity.
-It
has lower access speed.
-It
consume low power rate.
It
found in video graphic memory.
-It
used in system memory.
Types DRAM:
-FP (Fast page RAM): It
permit multiple access to a memory location and not required identification of
the address.
-EDO (Extended Data Output RAM): it has approximately 10%
increase over fast page. It also called Hyper page Mode (HPM).
-SRAM (Static Random Access Memory):
This contrary to DRAM, because it can retain
data without refreshing. It is faster and it has larger capacity size with more
expensive.
Features:
-Lower
power consumption.
-It
is used in CPU cache, such as Level 1.
-It
is used in hard drive buffer.
-It
is used in Digital Analog Converter (DAC) and video cards.
-it
can found in printer.
-It
is used in routers and LCD Screen.
-It
is used in Digital Cameras.
-SDRAM (Single data-rate Synchronous Dynamic
RAM): It is 64bits and
it has 168pins.
Features:
-It can process Read
AND Write instruction per clock circles, on which enhance transfer performance
rates of CPU.
-It has different
memory bank.
-It has ability to
receive fresh instruction before concluding executing current one.
-It in the market
competition since 1993 to date.
-RAMBUS: A
revolutionary memory technology developed by RAMBUS inc as a video memory and
designed for use in personal computers (PC) with Intel processors.
-RAM (Rambus Inline Memory Module):
It has 184pins modules.
-C-RIMM The
continuity module need to fill empty memory slot in the RAMBUS system.
DDR (Double data Rate Memory): It
has capability to do double read and write instruction per clock circle. It is
used in video game. It consists of 184pins.
-SODIMM: Is
a small outline version of DIMM. It has 144 or 200pins. It found in laptops
computer.
-SORIMM: Is
a small outline versions of RIMM, it consists of 144 or 200pins. It also found
in Laptops computer.
-DDR2 (Double Data Rate 2 Memory): It
operates twice the clock rate (2004-2007), but it not compatible with DDR.
-DCM (Dual Channel Memory): is resembled
DDR but their motherboard differed.
RAM
Module size is always double.
Graphics
Double Data Rate Synchronous Dynamic RAM (GDDR SDRAM): This type of was
designed only for video graphics with a dedicated graphics processing unit (GPU),
on video card, it can be 720p OR 1080p.
ELECTROSTATIC DISCHARGE
PRECAUTIONS:
Did
you ever try to touch metal door or your brother body and feel shock? If yes,
nothing than Electrostatic electricity. It has the capability of erasing stored
data in a device that is why it is necessary to take measures during repairs of
any electronic device as follows:
-Make
sure you wearer a static strap, that will attach to the chassis and worn on
your wrist during the repairs work.
-Keep
away any mobile phone near computer system.
-Use
discharge static hand gloves.
-By
using ESD Mat.
Consulted
Professional:
